NSN 5962-01-087-9497 PC734032, PC73403-2, ROM/PROM FAMILY 030
Product Details | MEMORY MICROCIRCUIT
5962-01-087-9497 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Part Alternates: PC734032, PC73403-2, ROM/PROM FAMILY 030, ROMPROMFAMILY030, 348202, 34820-2, 54143202, 541432-02, 5962-01-087-9497, 01-087-9497, 5962010879497, 010879497
Electrical and Electronic Equipment Components | Microcircuits, Electronic
Supply Group (FSG) | NSN Assign. | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | 30 DEC 1979 | 01-087-9497 | 41015 ( MICROCIRCUIT, MEMORY ) |
Cross Reference | NSN 5962-01-087-9497
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Technical Data | NSN 5962-01-087-9497
Characteristic | Specifications |
---|---|
OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
INPUT CIRCUIT PATTERN | 12 INPUT |
(NON-CORE DATA) BIT QUANTITY | 4096 |
(NON-CORE DATA) WORD QUANTITY | 1024 |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
MEMORY DEVICE TYPE | ROM |
OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
BODY LENGTH | 0.850 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
BODY WIDTH | 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT |
TEST DATA DOCUMENT | 09344-34820 DRAWING |
III UNPACKAGED UNIT WEIGHT | 5.0 GRAMS |
Restrictions/Controls & Freight Information | NSN 5962-01-087-9497
Category | Code | Description |
---|---|---|
Shelf-Life Code: | 0 | Nondeteriorative |
Hazardous Material Indicator Code | N | There is no data in the HMIS and the NSN is in an FSC not generally suspected of containing hazardous materials |
Demilitarization Code: | Q | Strategic List Item (SLI). Demilitarization not required. SLI are non-MLI(Munitions List Items) controlled by the U.S. Dept. of Commerce through the Export Administration Regulations (EAR) and indicated on the Commerce Control List (CCL). Each CCL entry is preceded by a four-digit Export Control Commerce Control List Item (CCLI) – MUT to the point of scrap required outside the United States. Inside the United States, MUT is required when the DEMIL integrity code (IC) is “3” and MUT is not required when the DEMIL IC is “6.” |
Controlled Inventory Item Code: | U | UNCLASSIFIED |
Electro-static Discharge Susceptible: | B | ESD sensitivity |
Precious Metals Indicator Code: | U | Precious metal type is unknown |
Criticality Code: | X | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
Category | Code | Description |
---|---|---|
NMF Description | 061700 | ELEC APPLIANCES/INSTRUMENTS NOI |
Less than car load rating | P | 77.5 |
Less than truck load rating | W | Rating Variable |
Water commodity Code | 738 | unknown |
Originating Activity Code | TX | Defense Supply Center Columbus Columbus, OH 43218 |
Air Dimension Code | A | Shipment is not a consolidation and does not exceed 72 inches in any dimension. |
Air Commodity | H | Signal Corps supplies and equipment, including radio equipment and supplies, communications equipment and supplies, electrical equipment and supplies, etc. |
Air Special Handling | Z | No special handling required. |
Special Handling Code | 9 | unknonwn |
HAZMAT | ||
Type of Cargo | 3 | Electrostatic Sensitive Device (ESD), subject to damage caused by electrostatic discharge. (See DoD 4500.32-R, Volume 1, Appendix A, Section I for additional information on ESD devices). |